Q2 General Membership Meeting of SEIPI’s ASEMEP-COUNCIL OF FAILURE ANALYSIS AND RELIABILITY (CFAR)

Q2 General Membership Meeting of SEIPI’s ASEMEP-COUNCIL OF FAILURE ANALYSIS AND RELIABILITY (CFAR)

  • May 18, 2022
  • Microsoft Teams
  • 2:00 PM
CFAR-Q2-GMM-Banner

Description

Registration is now open for the Q2 General Membership Meeting of SEIPI’s ASEMEP-COUNCIL OF FAILURE ANALYSIS AND RELIABILITY (CFAR) on May 18, 2022 (Wednesday), 2:00 PM, via Microsoft Teams.

This webinar is open for SEIPI members and non-members:

SEIPI Members – Free-of-charge
Non-members
– PhP 300

 Sign up here: https://bit.ly/3jOgM4p


 

ABSTRACTS:

Solutions for Characterization of Semiconductors

Lukas Hladik | Product Marketing Manager, TESCAN ORSAY HOLDINGS

TESCAN SOLARIS X pairs the high-throughput i-FIB+™ Xe plasma FIB column with the Triglav™ UHR electron column to extend the capabilities of FIB physical failure analysis to include large-area and deep cross-sectioning on advanced packaging, microelectromechanical devices, and optoelectronics.

Besides deep sectioning, this learning session will introduce the wider potential of TESCAN SOLARIS X for a Ga-free TEM sample preparation, homogenous FIB delayering of sub-10 nm technology nodes, and defect inspection on the whole 8” and 12” wafers.

Reliable Decapsulation by Microwave Induced Plasma: Applications in Device Failure Analysis and Reliability Tests

Mark McKinnon | Sales Director, JIACO Instruments

Decapsulation of semiconductor devices is performed to gain direct physical access to the underlying structures such as the die, bond wires, and bond pads for failure analysis. Industry changes such as the switching from gold to copper wire bonding for cost and performance reasons in the IC packaging industry have raised a problem for failure analysis. Mark McKinnon will explain the different decapsulation techniques and how multiple industry changes are driving the requirements for a highly selective decapsulation technique.

For more information, please contact Joy Gumban at joy.gumban@seipi.org.ph.


 

DOWNLOAD

  1. Program

CONTACT DETAILS

REGISTRATION AND EVENT DETAILS

Joy Gumban

joy.gumban@seipi.org.ph


SEIPI’s ANNUAL BUSINESS PARTNERS

first gen 2L GLOBE BUSINESS LOGO 2D - BLUE 2021 meralco pldt

 

 

Categories